Electronic devices permeate our daily lives and have become an indispensable part of modern society. Against this backdrop, the 4th Asia Conference on Electronics Engineering (ACEE 2027) will take place in Chengdu, China, from July 9 to 11, 2027. Hosted by the University of Electronic Science and Technology of China (UESTC) and organized by the School of Integrated Circuit Science & Engineering (the National Exemplary School of Microelectronics), the conference serves as a platform to gather researchers in relevant fields, who are committed to advancing the development of electronics engineering.Covering multiple research tracks, its topics include Microelectronics and Nanoelectronic Devices, Medical Electronics Technologies and Devices, and more.
ACEE 2027 welcomes original papers reporting significant and innovative research outcomes in emerging electronics engineering and its applications. We particularly encourage submissions featuring novel experiments, innovative applications of electronic technologies, and fresh analytical insights.
All papers will be sent to 2-3 peer-reviewers for reviewing. After a careful reviewing process, all accepted papers after proper registration and presentation, will be published into ACEE 2027 conference proceedings, and submitted for indexing by Scopus and Ei Compendex.
The paper or abstract could be submitted by
Electronic Submission System.
. Please note that only full paper could be accepted for publication.
Participants will check in and collect materials on Day 1. Keynotes and parallel sessions are scheduled for Days 2–3.
Feel free to register as a conference delegate even if you do not have a paper to present.
We've set some important dates for all participants. Please watch out the deadlines.
ACEE 2027 conference seeks papers presenting significant and novel research results on emerging electronics engineering and its applications. We especially encourage submissions that present novel experimentation, creative use of electronic technologies, and new insights made possible using analysis. We invite submissions on a wide range of electronics engineering’s topics. The list of topics include, but not limited to:
